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  • Notification of application for Shenzhen-Hong Kong Jointly Funded Project 2023-2024

Notification of application for Shenzhen-Hong Kong Jointly Funded Project 2023-2024

November 13, 2023 Notice

The application for Shenzhen-Hong Kong Jointly Funded Project 2022-2023 has started, and the application requirements are as follows:

I. Application Contents

Shenzhen-Hong Kong Jointly Funded Project. The applicants in Shenzhen and Hong Kong shall submit their applications to the local science and technology departments for the same cooperation project, and the science and technology departments in the two places will provide financial support respectively after the project is approved and initiated through the joint review in the two places.

Key supported fields: Internet of Things, big data, cloud computing, artificial intelligence, integrated circuits, new displays, information security, 5G, quantum information, and third-generation semiconductors; medical biotechnology and modern traditional Chinese medicine, population health technology, water environmental governance and ecological restoration, agricultural biological breeding; graphene materials, advanced electronic information materials, display materials, new energy materials, high-performance polymer materials, hydrogen energy and fuel cells; robot and intelligent equipment, intelligent unmanned system, additive manufacturing and laser manufacturing;digital creativity, blockchain, visible light communication and optical computing.

 

II. Funding Intensity and Research Period

By means of prior funding, the maximum funding for a single project is RMB 3 million and project implementation period is generally two years.

 

III. Application Conditions

The application for Shenzhen-Hong Kong Jointly Funded Project shall meet the following conditions:

(a) The cooperative unit in Hong Kong shall be public scientific research institutions in Hong Kong (including all institutions funded by University Grants Committee, self-funded local degree-awarding institutions registered under the Post Secondary Colleges Ordinance (Cap. 320), Hong Kong Productivity Council, Vocational Training Council, Garment Industry Training Council and Hong Kong Biotechnology Research Institute) or R&D Centers established under the innovation and technology funds (i.e., Auto Parts R&D Center, Textile and Clothing R&D Center, Information and Communication Technology R&D Center, Logistics and Supply Chain Multitech Technology R&D Center, Nano and Advanced Materials R&D Institute).

(b) The applicant has signed a cooperation agreement with the Hong Kong cooperative unit to clarify the rights and obligations such as technology, manpower, equipment, capital investment, intellectual property ownership, etc., and will jointly carry out research activities.

(c) The Shenzhen and Hong Kong units apply to their respective science and technology departments, and the unilateral application is invalid.

 

IV. Application Process

The project applicant shall fill in, upload and submit the attachment materials online through Shenzhen Science and Technology Management System https://sticapply.sz.gov.cn/. 

The following materials shall be provided for applying the project:

 (a) For projects involving scientific research ethics and science and technology security, relevant certificates (photocopies) required by relevant national laws, regulations and ethical standards shall be provided.

 (b) The original of project feasibility research report.

 (c) A copy of the cooperation agreement signed by both parties (with the seal of both parties and the original inspection).

 (d) A copy of the project application submitted by the Hong Kong cooperative unit to the Hong Kong government.

 (e) Declaration of intellectual property compliance.

 (f) Commitment letter of scientific research integrity.

 

V. Notices

 (a) The project leaders and members can apply for only one Shenzhen-Hong Kong-Macao Science and Technology Plan or "Shenzhen-Hong Kong Innovation Circle" project.

 (b) The project proposed by both Shenzhen and Hong Kong must be the same, and the research contents of the applications of both parties shall be prepared respectively according to the division of labor in the cooperation agreement.

 (c) The cooperation agreement shall be stamped with the official seals of Shenzhen and Hong Kong units and signed by the project leaders of both parties.

 

VI. Deadline

Online filling time: All attachment materials shall be uploaded and a written application shall be submitted online before January 05, 2024, and RAO will review and give feedback. No paper materials are required to be submitted temporarily. After the RAO has reviewed and submitted, the applicant clicks "Signature and Seal Page Print", scans and uploads the printed document after signing and sealing, and submits it for review (the acceptance status of the system is "Pending Window Acceptance").

 

VII. Contact Information

Yaqing Xu xuyaqing@cuhk.edu.cn 23515209

24.07 KB
附件1:2023-2024年度深港联合资助项目(深港澳科技计划A类项目)申请指南 Annex 1 Guide.docx
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附件2:深港联合资助项目(深港澳科技计划A类项目)申请书 Annex 2 Application Form.docx
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附件3:深圳市2023-2024年度深港联合资助项目(深港澳科技计划A类项目)形式审查要点表 Annex 3 Key points of Formal Review.docx
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附件4:知识产权合规性声明(模板) Annex 4 Intellectual property compliance statement.docx
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附件6:廉洁告知书(模板)Annex 6 Integrity Notice.docx
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附件5:科研诚信承诺书(模板) Annex 5 The letter of integrity.docx

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